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job opening at Intel
[版面:工程][首篇作者:dxupa] , 2015年12月17日00:44:34 ,1023次阅读,3次回复
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dxupa
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发信人: dxupa (VA+fisherman), 信区: Engineering
标  题: job opening at Intel
发信站: BBS 未名空间站 (Thu Dec 17 00:44:34 2015, 美东)

See job description below. Recent college graduate only.
if interested, 请站内联系。



Sr. Materials Engineer

Description

Come join a creative team of Senior Materials Engineers dedicated to the
development of microelectronic packages. Our engineers provide project
management, package design/development, and sustaining support for
integrated circuit or semiconductor assemblies. Our engineers work in cross-
functional teams to define overall package performance and specification and
realize technology certification through test vehicle design and
implementation. Engineers conduct tests and research on basic materials and
properties, establish material specifications for raw material vendors, and
interface with Quality Assurance and Purchasing regarding material quality
and vendor performance. Microelectronics Packaging Engineers utilize their
formal education and judgment to develop solutions to problems. 

Qualifications

You must possess the below minimum qualifications to be initially considered
for this position. Preferred qualifications are in addition to the minimum
requirements and are considered a plus factor in identifying top candidates.
Experience listed below would be obtained through a combination of your
school work/classes/research and/or relevant previous job and/or internship
experiences.

Minimum Qualifications:

The candidate must possess a Ph.D. in Materials Science, Chemistry, Chemical
Engineering, or any other electronics packaging related field.

Candidate must have 6 + months of work or educational experience in the
following:
- Understanding of metals and alloys (especially solders), micro-macro
structures, and phase diagrams.
- Knowledge of mechanical metallurgy, thermodynamics-kinetics of
metallurgical reactions, coupling and interaction of dissimilar metals.
- Knowledge of physical-chemical-thermal-mechanical properties of metallic
materials.
- Understanding of metrologies for characterization of metallic materials (
surface-bulk).

Preferred Qualifications:
- Knowledge of interactions of solders with surface finishes and structure-
property-performance of intermetallics.
- Understanding of interactions of metallic materials with Polymeric
materials.

Job Category: Engineering
Primary Location: USA-Arizona, Phoenix
Full/Part Time: Full Time
Job Type: College Graduate
Regular/Temporary: Regular

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CincySniper
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发信人: CincySniper (老烟枪), 信区: Engineering
标  题: Re: job opening at Intel
发信站: BBS 未名空间站 (Mon Dec 21 12:35:24 2015, 美东)

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Bass Fisherman
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xuedi2006
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发信人: xuedi2006 (southman), 信区: Engineering
标  题: Re: job opening at Intel
发信站: BBS 未名空间站 (Sat Jan  2 16:40:11 2016, 美东)

是不是,毕业几年的不要?陶瓷专业要吗?
【 在 dxupa (VA+fisherman) 的大作中提到: 】
: See job description below. Recent college graduate only.
: if interested, 请站内联系。
: Sr. Materials Engineer

: Description
: Come join a creative team of Senior Materials Engineers dedicated to the
: development of microelectronic packages. Our engineers provide project
: management, package design/development, and sustaining support for
: integrated circuit or semiconductor assemblies. Our engineers work in
cross-
: functional teams to define overall package performance and specification
and
: ...................



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plusenergy
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发信人: plusenergy (正能量), 信区: Engineering
标  题: Re: job opening at Intel
发信站: BBS 未名空间站 (Wed Mar 30 16:25:08 2016, 美东)

lz好人,赞分享
【 在 dxupa (VA+fisherman) 的大作中提到: 】
: See job description below. Recent college graduate only.
: if interested, 请站内联系。
: Sr. Materials Engineer

: Description
: Come join a creative team of Senior Materials Engineers dedicated to the
: development of microelectronic packages. Our engineers provide project
: management, package design/development, and sustaining support for
: integrated circuit or semiconductor assemblies. Our engineers work in
cross-
: functional teams to define overall package performance and specification
and
: ...................



--
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